Less residue, cleaner joints
The no-clean formulation minimizes post-soldering residue, reducing cleanup steps after rework.
Hvorfor kundene elsker det
The KINGBO RMA-218 is a high-viscosity, no-clean solder flux paste designed for precision electronics assembly and repair, delivering dependable performance for BGA, CGA, and CSP package work.
The no-clean formulation minimizes post-soldering residue, reducing cleanup steps after rework.
High viscosity keeps components firmly in place during soldering, improving precision and stability.
Excellent for BGA reballing and ball attachment, making it a dependable choice for professional rework.
The 10cc size is easy to store and use, ideal for technicians and hobbyists alike.
Spesifikasjoner
The KINGBO RMA-218 is a high-viscosity, no-clean solder flux designed for precision electronics assembly and repair. It provides reliable performance for attaching balls to BGA, CGA, and CSP packages, making it an essential tool for professional rework.
Perfect for technicians and hobbyists working on smartphones, LEDs, or circuit boards that require reliable solder joints.
Alt du kan trenge å vite før du bestiller.
Gratis standardfrakt
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